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Detail Information
| Attribute | Details |
|---|---|
| Place Of Origin | Guangdong, China |
| Certification | RoHS |
| Product Name | E1-MH318G |
| Operating Temperature | 260°C |
| Elongation | ≥5% |
| Total Thickness | 0.145±0.010mm |
| Color | Off-White |
| Tensile Strength Steel | ≥2KN/M |
| Packaging Details | Poly Bag + Carton |
| Supply Ability | 10000 M²/Day |
| Highlight | 0.145mm Heat Resistant Adhesive Tape, ESD Heat Resistant Adhesive Tape, ESD high temp resistant tape |
Product Description
Anti Static Heat Resistant Adhesive Tape
Anti-Static And High-Temperature Masking Tape E1-MH318G With Excellent High Temperature Resistance
E1-MH318G is an anti-static and high-temperature masking tape. The product not only has good adhesiveness, but also has no residue on the surface after removal, and provides high-temperature shielding protection for important areas.
Features And Benefits:
E1-MH318G with excellent high temperature resistance and high instantaneous bonding strength, easy to remove, no glue residue.
Properties:
| Item | Typical Value |
| Total Thickness | 0.145±0.010mm |
| colour | Off-white |
| Adhesion to Steel | ≥2N/25mm |
| Tensile Strength | ≥2KN/M |
| Elongation | ≥5% |
| Surface Resistance | 106-1011ohms |
| Operating Temperature | 260℃ |
Construction:
Application:
Mainly used in the circuit board wave soldering process to protect the gold fingers on the circuit board and other sockets, surface protection, etc.
Storage
1. Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.
2. Shelf life: 12 months from the date of manufacture when stored in initial packing.
Precaution Reminder:
1. Surface should be clean, dry, free of dust, oil or other contaminants.
2. Proper pressure required by roller, hand or press when applying.
3. Avoid repeat sticking to prevent adhesion decrease.
Notes:
Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.